Semicon 2.0 Launch & 12 New ECMS Approvals Overview
Union Minister for Electronics and Information Technology Ashwini Vaishnaw launched the Semicon 2.0 web application portal on November 6, 2026, opening applications for Pillars 2, 3, and 4—spanning semiconductor machinery and materials, new fabrication facilities, and the expansion of assembly, testing, marking, and packaging (ATMP) alongside outsourced semiconductor assembly and test (OSAT) ecosystems. Concurrently, the government announced 12 new approved applicants under the Electronics Components Manufacturing Scheme (ECMS), representing projected investments of ₹7,503 crore ($789.27 million), estimated output of ₹39,045 crore ($4.11 billion), and 7,127 direct jobs. This builds upon the first phase of the Semicon India Programme, which has approved 12 projects across six states worth over ₹1.64 lakh crore ($17.25 billion) in cumulative investments, with five units already commencing commercial production by October 2026. Spanning seven states—Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu, and Uttar Pradesh—the 12 fresh ECMS approvals cover 10 critical component categories, including multi-layer PCBs, relays, heat sinks, camera rims, polypropylene film, and capital goods, alongside first-time approvals for copper foil, cathode active materials, and specialty ceramics. With these additions, total approved ECMS applications stand at 118 across 16 states and 34 product segments, mobilizing ₹77,051 crore ($8.11 billion) in expected investments, ₹5,73,146 crore ($60.30 billion) in projected production, and 81,755 direct jobs—with MSMEs accounting for nearly half of all approved units. Looking ahead, Semicon 2.0 specifically targets onboarding at least three global semiconductor equipment makers and five specialty chemical and gas suppliers to localize upstream supply chains and reduce import reliance. KAYNES



















