$PARAS

Paras Defence & Space Technologies traded lower in early trade on Wednesday despite announcing plans to invest around Rs 6,200 crore in a greenfield semiconductor packaging facility in Madhya Pradesh. The company said its wholly owned subsidiary, Paras Semiconductors Pvt Ltd, has signed a memorandum of understanding (MoU) with the Madhya Pradesh State Electronics Development Corporation (MPSeDC) to set up an Outsourced Semiconductor Assembly and Test (OSAT) facility in the Indore-Ujjain region. According to the company's exchange filing, Paras Semiconductors will establish the advanced IC packaging OSAT facility with a proposed investment of approximately Rs 6,200 crore. The proposed plant will undertake advanced semiconductor packaging operations, including 3D heterogeneous integration, 2.5D and 3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing, and reliability assessment. The project will be developed in collaboration with MPSeDC, leveraging the expertise and resources of both entities. The investment is expected to strengthen India's domestic semiconductor packaging and testing ecosystem under the India Semiconductor Mission.