PARAS DEFENCE SUBSIDIARY TO INVEST Rs 6200 CRORE FOR SETTING UP SEMICONDUCTOR PACKAGING FACILITY IN MADHYA PRADESH

Paras Semiconductors Private Limited, a subsidiary of

, will invest around Rs 6,200 crore to set up a greenfield advanced semiconductor packaging facility in Madhya Pradesh. The company has signed a Memorandum of Understanding (MoU) with the Department of Science and Technology, acting through the MP State Electronics Development Corporation (MPSeDC), for the project. The proposed Outsourced Semiconductor Assembly and Test (OSAT) facility will be located in the Indore-Ujjain region and will focus on advanced integrated circuit (IC) packaging technologies. The project is intended to strengthen India's semiconductor packaging capabilities as the country expands it's domestic electronics manufacturing and chip ecosystem.