IZMO

IZMO Microsystems Achieves Space-Grade 3D Packaging Breakthrough Technology Milestone - Developed 3D System-in-Package (SiP) for space payload camera electronics. - 84% footprint reduction: From 200×200 mm to 81×81 mm. Technical Innovation - Advanced 3D stacked-substrate architecture with bare-die integration. - Housed in indigenous hermetic ceramic package. Space Qualification - Meets space-grade reliability standards for extreme thermal, vibration, radiation conditions. - Critical for satellite payload miniaturization and mission life extension. Strategic Impact - Positions IZMO as leader in high-reliability space electronics. - Opens doors to ISRO/DRDO contracts and export opportunities. Key Takeaway: 84% size reduction in space-grade SiP validates IZMO's technical leadership, positioning it for defence-space order wins.