Cyient DLM Ltd Share Price

Overview

Cyient DLM Ltd share price is currently ₹753.90, up by ₹29.53 (4.08%) from its previous closing price of ₹724.37. The share price has gained 14.61% over the past month and gained 78.11% over the past year. The stock's 52-week low and high are ₹261.41 and ₹762.65, respectively. Cyient DLM Ltd has a market capitalisation of ₹ 5,720.00 Cr. The share price was last updated on 25 Aug 2026, 12:29 PM IST.

Cyient DLM Ltd

CYIENTDLM

₹0.00

₹29.53

4.08%

Capital Goods

₹0.00(%)1D

Updated: 25 Aug 2026, 12:29:20 pm IST

Market Data

Open Price

₹733.38

Prev. Close

₹724.37

₹726.25

Day Low

₹762.65

Day High

₹261.41

52 Week Low

₹762.65

52 Week High

Capital GoodsElectronics - Components

CategorySmall Cap

Fundamentals

Quick Bite

Price To Earnings Ratio

72.91

Sector PE

48.27

PB Ratio

5.94

Sector PB

7.09

EPS

10.34

Dividend Yield

0.00

Today's Volume

478.972 K

5 Day Avg. Volume

480.371 K

PEG Ratio

9.63

Market Cap.

₹ 5,720.00 Cr.

StockGro Trade views

Technical Analysis

Forecasts 🧭

Financials

Corporate Actions

Corporate Actions will be available shortly.

Mutual Fund Ownership

Mutual Fund Holder	Jun 26 Shares held	Jul 26 Shares held
HDFC Defence Fund - Regular Plan - Growth	55.11 Lac	51.58 Lac (6.41%)
Franklin India Multi Cap Fund - Regular Plan - Growth	27.96 Lac	27.96 Lac no change
HDFC Manufacturing Fund - Regular Plan - Growth	22.00 Lac	22.00 Lac no change
ICICI Prudential Smallcap Fund - Growth	11.93 Lac	16.11 Lac (35.03%)
Nippon India Power & Infra Fund - Growth Option	16.63 Lac	15.93 Lac (4.21%)

Show all holdings

About Cyient DLM Ltd 👋

Cyient DLM Limited is an integrated electronics manufacturing solutions provider that offers design led manufacturing (DLM) solutions to customers. The Company operates through manufacturing and providing the Electronic Manufacturing Services segment. It delivers design, manufacturing, testing, and certification support. Its Electronic Manufacturing Services are provided as build to print (B2P) and build to specification (B2S) services to its clients. Its B2P solutions involve its client providing the design for the product for which it provides agile and flexible manufacturing services. Its B2S services involve utilizing its design capabilities to design the relevant product based on the specifications provided by the client and manufacturing the product. Its solutions primarily comprise printed circuit board assembly (PCBA), cable harness assembly, box builds and precision machining. It serves various industries, including aerospace and defense, industrial, and medical technology.